ASMPT manufactured eutectic die bonder
High-speed eutectic die bonder
The AD211Plus-II is a device capable of high-speed eutectic bonding of diced chips to substrates or lead frames. It has a strong track record of implementation for LEDs, including automotive lighting and outdoor lighting. Product Features: - Alignment accuracy: 7μm - Cycle time: 540ms - Mirage prevention function during heat-up - Distinctive work holder/heat-up stage - Control function with a void rate of 3% or less - Extensive domestic and international implementation track record - Applications: Automotive, photonics, LEDs, LiDAR
- Company：兼松ＰＷＳ
- Price：Other
